Application of Convection and Infrared Heat Sources for Mounting and Demounting of Electronic Modules
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LANIN, V., PARKOVSKII, V.. Application of Convection and Infrared Heat Sources for Mounting and Demounting of Electronic Modules . In: Surface Engineering and Applied Electrochemistry, 2009, nr. 6(45), pp. 507-511. ISSN 1068-3755.
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Surface Engineering and Applied Electrochemistry
Numărul 6(45) / 2009 / ISSN 1068-3755 /ISSNe 1934-8002

Application of Convection and Infrared Heat Sources for Mounting and Demounting of Electronic Modules

Pag. 507-511

Lanin V., Parkovskii V.
 
 
 
Disponibil în IBN: 30 noiembrie 2013


Rezumat

The parameters were optimized of convection and infrared heat sources for mounting and demounting of electronic modules on printed circuit boards with surface-mounted electronic components. The modeling of the thermoprofiles of convection and infrared sources allows one to optimize the process duration and the temperature of heating of the electronic components.