The work deals with the solution of the fundamental problem of the modern electroplating technology of functional materials by the controlled synthesis of metal silver and gold coatings with tailor-made properties for microelectronics. The range of the stable process of functional deposition (minimal dynamic instability of the system) (the electrochemical resistance is 4RT/anFjlim under polarization with current j=0.4/0.6jlim) where the most favourable energetic of preferential crystal face growth at the minimal work of surface formation is realized, has been determined; this allows one to obtain in any electrolyte deposits of electrolytic gold and silver whose physicochemical properties are stable. A new law governing electrochemical kinetics has been established: the discharge of different coordination silver (I) and gold (I) ions occurs by a common mechanism. A selfconsistent parameter, which is the electrochemical resistance of a system, the nature of complex ion and electroactive complex (EAC) formation conditions, is proposed as a correlation parameter for the prediction of the functional properties of silver and gold coatings. New engineering solutions have been found: alternative ways of replacing contact gold by alloys based on refractory metals with iron subgroup metals have been developed; a new selective method for the electrochemical regeneration of silver has been developed; electrolytes have been optimized (the electrolyte composition, the nature of EAC, the range of stable electrodeposition, electrolysis conditions have been justified); the problems of contact exchange, passivation of anodes, increasing the service life of buffer electrolytes have been solved; these electrolytes have been introduced in technologies for the deposition of conducting contact layer of gold, silver, tungsten and molybdenum alloys and competitive articles of micro- and nanoelectronics with considerable (up to 15%) reduction of rejected products [1-5].