Deposition of nickel films by TVA

Surdu-Bob C.; Badulescu M.; Lungu C.; Georgescu Costinela

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SURDU-BOB, C., BADULESCU, M., LUNGU, C., GEORGESCU, Costinela. Deposition of nickel films by TVA. In: Moldavian Journal of the Physical Sciences, 2008, nr. 2(7), pp. 145-151. ISSN 1810-648X.

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Moldavian Journal of the Physical Sciences

Numărul 2(7) / 2008 / ISSN 1810-648X /ISSNe 2537-6365

Deposition of nickel films by TVA

Pag. 145-151

Surdu-Bob C., Badulescu M., Lungu C., Georgescu Costinela

Institutul Naţional pentru Fizica Laserilor, Plasmei şi Radiaţiei

Disponibil în IBN: 13 decembrie 2013

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Plasma diagnostic techniques are essential for understanding of process parameters. In plasma-assisted deposition, ion energy and deposition rate are key parameters for technological control. In this paper, a systematic study of the correlation of electrical parameters of plasma with ion energy distributions and deposition rate is presented. The deposition method used in this study is Thermionic Vacuum Arc (TVA) ignited in nickel vapors. The TVA deposition method briefly consists in obtaining of plasma in vapors of the material to be evaporated. The vapors are obtained by heating the material with thermoelectrons generated by an externally heated filament. An in-house, computer-controlled RFA analyzer was used for determination of ion energy distributions at a point situated about 25 cm from the anode. The retarding field analyzer (RFA) is an electrical probe capable of providing ion energy distributions in plasmas. AFM analysis has shown that nickel films obtained by TVA are very smooth. It was found that the ion energy increases with the power introduced into the system and it decreases with decreasing filament current. The adhesion for the films deposited by TVA was found to be very good. A clear picture of the optimal TVA plasma conditions for the highest adhesion and deposition rate was obtained.

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plasma-assisted deposition, ion energy and  deposition rate are key parameters for 

technological control. 
In this paper, a systematic study of the correlation of electrical parameters of plasma 
with ion energy distributions and deposition rate is presented. 

The deposition method used in this study is Thermionic Vacuum Arc (TVA) ignited in 

nickel vapors. 
The TVA deposition method briefly consists in obtaining of plasma in vapors of the 
material to be evaporated. The vapors are obtained by heating the material with 
thermoelectrons generated by an externally heated filament. An in-house, computer-controlled 
RFA analyzer was used for determination of ion energy distributions at a point situated about 
25 cm from the anode. The retarding field analyzer (RFA) is an electrical probe capable of 
providing ion energy distributions in plasmas. AFM analysis has shown that nickel films obtained by TVA are very smooth. 

It was found that the ion energy increases with the power introduced into the system and 
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was found to be very good. A clear picture of the optimal TVA plasma conditions for the 
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