IR detectors array
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2023-09-13 17:30
SM ISO690:2012
KOROTCHENKOV, Ghenadii. IR detectors array . New York: 2023, pp. 79-106. ISBN 978-303120510-1, 978-303120509-5DOI: 10.1007/978-3-031-20510-1_4
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Handbook of II-VI Semiconductor-Based Sensors and Radiation Detectors: Volume 2, Photodetectors
2 / 2023 / ISBN 978-303120510-1, 978-303120509-5

IR detectors array

DOI:https://doi.org/10.1007/978-3-031-20510-1_4

Pag. 79-106

Korotchenkov Ghenadii
 
Moldova State University
 
 
Disponibil în IBN: 30 mai 2023


Rezumat

This chapter examines the features of IR detectors array, the technologies used for their manufacture and their areas of possible application. In particular, it describes the approaches used to develop thermal imaging cameras based on the Focal-Plane Arrays (FPAs). This chapter provides a comparative characteristic of the types of IR receivers, analyzes the materials used in the development of photonic IR FPAs, describes the features of the manufacture of photovoltaic HgCdTe FPAs and the specifics of the operation of cooled FPAs. The trends of FPAs development such as pixel size reduction, the increase of operating temperatures and the elaboration of monolithic FPAs are also analyzed in this chapter.

Cuvinte-cheie
Avalanche photodiodes (APD), CdZnTe (CZT), Charge-coupled devices (CCD), Complementary metal-oxide-semiconductor (CMOS), Cooled, cooling, Dual-band detector, Flip-chip bonding, Focal-plane array (FPA), FPA technology, GaAs/AlGaAs, HDVIP architecture, heterostructures, HgCdTe, HgCdTe (MCT), HgTe/CdTe, HOT, hybridization, InAs/GaSb, Indium bump technique, Loophole technique, Mesa structure, Microbolometric, Molecular beam epitaxy (MBE), Monolithic, Multi-spectral, Multiplexer, NBn barrier structure, Optical-mechanical system, peltier element, photodetectors, Photonic, photovoltaic, Pixel, Pyroelectric, QDIP, Quantum dots (QDs), Quantum well, Quantum-dimension structures, QWIP, Readout integrated circuits (ROIC), Scanner, Scanning, Semiconductor materials, Si-based substrate technology, Split-Stirling cycle, superlattices, swap, Thermal, Thermal imaging camera, Thermography, Two-color, Type-1 (T1SL), Type-II (T2SL), Type-III