The main approaches to the local submicron electrodeposition of metals are considered. These approaches are developed by various researchers for creating electronic devices, electromechanical devices, sensors, catalysts, etc. The developed processes of electrochemical deposition of metals onto the metal and semiconductor substrates for the purpose of micro- and nanostructuring and surface modification enable one to obtain the deposits in the shape of nanoscale tubercles, fine lines, and threads. Thin rods tens nanometers in size with variously shaped end-faces are used as the tool-electrode (anodes). The interelectrode distances are of the same order of magnitude. To raise a degree of localization (up to submicron dimensions), ultrashort voltage pulses (from one to hundreds of nanoseconds) are used. The mechanism of localization of electrochemical processes by ultrashort pulses is considered.  A specific line of the works is associated with the use of equipment for scanning probe microscopy, where a conductive probe is used as the tool-electrode. This method is used not only for electrodeposition, but also for other methods of local electrochemical machining, for etching, oxidation of metals and semiconductors.  Localization of metal electrodeposition can be also achieved by the mechanical activation of sites intended for deposition. Another method for localizing electrochemical processes is indirect electrodeposition, when the workpiece (substrate) is not connected to an external power source, and its potential is determined by the potential of redox couple in the solution. Ions containing metal intended for deposition on the substrate (for example, AuCl4-) are formed by the dissolution of an ultramicroelectrode (anode) of this metal connected to an external power source in the circuit with an auxiliary electrode. These ions move towards the substrate, where they are reduced to the metal (Au), and the released anions (Cl-) react on the ultramicroelectrode to form metal-containing ions (AuCl4-). The methods of numerical modeling of local metal deposition are developed [1, 2]. An example of simulated results shows the possibilities to control the local electrodeposition.