Conţinutul numărului revistei |
Articolul precedent |
Articolul urmator |
596 1 |
Ultima descărcare din IBN: 2018-08-02 11:37 |
SM ISO690:2012 BĂJENESCU, Titu-Marius. Thermodynamic degradation. In: EEA - Electrotehnica, Electronica, Automatica, 2017, nr. 4(65), pp. 96-100. ISSN -. |
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EEA - Electrotehnica, Electronica, Automatica | ||||||
Numărul 4(65) / 2017 / ISSN - /ISSNe 1582-5175 | ||||||
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Pag. 96-100 | ||||||
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Rezumat | ||||||
Smaller, lighter, faster, cheaper are today demands in microelectronics; new technologies stack and interconnect materials and components are utilised to achieve high density, small size, low weight, reduced power, and very low cost. Particularly important in this context is the thermodynamic degradation that offers new tools, new ways to solve PoF problems and prevent failure. Prognostics using a thermodynamic energy approach should advance our capabilities. |
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Cuvinte-cheie ALD, CVD, Reliability limitations, Diffusion barrier, Microelectronic interconnections, POF |
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