We have demonstrated that the micro- and macrodistribution of electrodeposition rates at plating of copper from standard electrolyte in large range of current densities and thickness of electrodeposited layers (L ~ 0,13 – 0,5; L – thickness of electrodeposited layer related to mask thickness) is uniform. In the case of plating of silver from complex electrolyte the uniformity of macrodistribution is observed only for small thickness of electrodeposited layers (L ~ 0,13 – 0,15). At high thickness of electrodeposited layers the uniformity of the microand macrodistribution is determined by hydrodynamic conditions. It is shown that thick mask is like “a leveling agent”, which provides uniformity of treatment rates distribution.