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 SM ISO690:2012ЛАНИН, В.. Лазерная пайка и микросварка изделий электроники. In: Электронная обработка материалов, 2005, nr. 3(41), pp. 79-84. ISSN 0013-5739. |
| EXPORT metadate: Google Scholar Crossref CERIF DataCite Dublin Core |
 Электронная обработка материалов |
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| Numărul 3(41) / 2005 / ISSN 0013-5739 /ISSNe 2345-1718 | ||||||
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| Pag. 79-84 | ||||||
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Parameters of the laser soldering and microwelding of electronics products are investigated and optimized. Optimum modes of the laser soldering are: capacity 24 Wt, diameter of a beam of 2.5 mm, speed of moving 7 mm / with, productivity up to 300 contacts/minutes. Depth of fusion at microwelding linearly depends on energy of radiation, duration of a pulse and diameter of a laser beam. |
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