Electrochemical Deposition by Design of Metal Nanostructures
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2023-04-05 13:28
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MONAICO, Eduard, MONAICO, Elena, URSACHI, Veaceslav, TIGINYANU, Ion, NIELSCH, Kornelius. Electrochemical Deposition by Design of Metal Nanostructures. In: Surface Engineering and Applied Electrochemistry, 2019, vol. 55, pp. 367-372. ISSN 1068-3755. DOI: https://doi.org/10.3103/S1068375519040070
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Surface Engineering and Applied Electrochemistry
Volumul 55 / 2019 / ISSN 1068-3755 /ISSNe 1934-8002

Electrochemical Deposition by Design of Metal Nanostructures

DOI:https://doi.org/10.3103/S1068375519040070

Pag. 367-372

Monaico Eduard1, Monaico Elena1, Ursachi Veaceslav2, Tiginyanu Ion1, Nielsch Kornelius34
 
1 National Center for Materials Study and Testing, Technical University of Moldova,
2 Institute of the Electronic Engineering and Nanotechnologies "D. Ghitu",
3 Leibniz Institute for Solid State and Materials Reseach, Dresden,
4 Technische Universitat Dresden, Dresden
 
 
Disponibil în IBN: 10 martie 2023


Rezumat

We report on the application of specially-designed masks for the purpose of electrochemical etching of InP single crystals which enables one to change in a controlled fashion the direction of propagation of pores, including those propagating in directions parallel to the top surface of substrates. The fabricated templates have been used to electrochemically deposit metallic nanostructures along predefined directions and to develop two-dimensional arrays of metallic nanotubes or nanowires embedded in semiconductor matrices. 

Cuvinte-cheie
arrays of nanopores, Au nanodots, controlled electrodeposition, electroplating, Porous semiconductor