The Swiss Society for Thermal Analysis and Calorimetry STK (www.stkonline.ch) promotes scientific research in these fields, most notably by granting the STK Award for outstanding scientist as well as the STK Young Scientist Award for promising scientist under 40 years of age. Founded in 1975 by Dr. Erwin Marti (CibaGeigy Basel) and Prof. Hans-Rudolf Oswald (University of Zurich), STK fosters collaboration between universities and industry.[1] Our members as well as other interested participants gather every year for the Annual Meeting, which takes place in various laboratories active in thermal analysis in Switzerland. STK cultivates contacts with international organizations with related aims and is a member of ICTAC. The European industrial demand for plastics summed up to 46.3 million tons in 2013.[2] One of the biggest challenge is to predict how the material will stand time: extremely diversified applications expose the base polymers to strong temperatures variations.[3] Base materials suppliers perform standardized tests, and propose target temperature windows and conservative lifetimes. But the application industries are producing final objects that will be exposed to non-constant environmental stresses, and often for much longer times than advised by the base material suppliers. At HESSO in Fribourg, we have launched a research collaboration with major industrial partners producing final products to study the degradation of polymers.[4] We first investigated thermally-induced chemical damages, and then concentrated on physical, or structural, deterioration. Recently, we investigated the recycling process of a high performance engineering polymer. Small parts produced with this material generate a significant quantity of offcuts (~60%) that must be reprocessed to be re-useable for further production, an operation inducing a large thermal load on the polymer. Both differential scanning calorimetry (DSC) and Raman spectroscopy are extensively used for the characterization of polymers. DSC, the method of choice for analyzing thermal behavior, is destructive; Raman spectroscopy probes the structure of materials by non-destructively measuring molecular vibrations. By combining them, we can assign thermal events to structural and chemical changes, substantially facilitating interpretation. A portable DSC has been combined with a Raman system to create a hyphenated prototype allowing simultaneous acquisition of thermal and spectral data in one single analysis.[5]