Wang Kun
Publicații indexate în SCOPUS -
(3), Descărcări - 2, Vizualizări - 1878
ISO 690-2012
Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography
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| Wang Kun , He Bin , Li Ming-He , Ji Yun |
| Электронная обработка материалов |
| Nr. 2(48) / 2012 / ISSN 0013-5739 / ISSNe 2345-1718 |
| Disponibil online 18 January, 2014. Descarcări-2. Vizualizări-708 |
Electrochemical Micromachining Using Vibratile Tungsten Wire for High Aspect Ratio Microstructures
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| Wang Kun |
| Surface Engineering and Applied Electrochemistry |
| Nr. 5 / 2010 / ISSN 1068-3755 / ISSNe 1934-8002 |
| Disponibil online 13 December, 2013. Descarcări-0. Vizualizări-661 |
| Electrochemical Micromachining Using Vibratile Tungsten Wire for High-Aspect-Ratio Microstructures |
| Wang Kun |
| Электронная обработка материалов |
| Nr. 5 / 2010 / ISSN 0013-5739 / ISSNe 2345-1718 |
| Disponibil online 30 March, 2017. Descarcări-0. Vizualizări-509 |
