Wang Kun
Articole în reviste din RM - 3, Descărcări - 2, Vizualizări - 1878
Fabrication of biomimetic wet adhesive pads with surface microstructures by combining electroforming with soft lithography |
Wang Kun , He Bin , Li Ming-He , Ji Yun |
Электронная обработка материалов |
Nr. 2(48) / 2012 / ISSN 0013-5739 / ISSNe 2345-1718 |
Disponibil online 18 January, 2014. Descarcări-2. Vizualizări-708 |
Electrochemical Micromachining Using Vibratile Tungsten Wire for High Aspect Ratio Microstructures |
Wang Kun |
Surface Engineering and Applied Electrochemistry |
Nr. 5(46) / 2010 / ISSN 1068-3755 / ISSNe 1934-8002 |
Disponibil online 13 December, 2013. Descarcări-0. Vizualizări-661 |
Electrochemical Micromachining Using Vibratile Tungsten Wire for High-Aspect-Ratio Microstructures |
Wang Kun |
Электронная обработка материалов |
Nr. 5(46) / 2010 / ISSN 0013-5739 / ISSNe 2345-1718 |
Disponibil online 30 March, 2017. Descarcări-0. Vizualizări-509 |