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Afisarea articolelor 1-3(3) pentru cuvîntul-cheie "copper"
Kinetics of metal deposition in the process of electroless fabrication of porous InP-Cu nanocomposite
Dicusar Alexandr1, Globa Pavel1, Redcozubova Olga1, Sidelinicova Svetlana1, Sîrbu Lilian2, Vieru Veaceslav2, Tighineanu Ion12
1 Institute of Applied Physics, Academy of Sciences of Moldova,
2 Technical University of Moldova
Electrochemical and Solid-State Letters
Nr. / 2005 / ISSN 1099-0062
Disponibil online 13 April, 2018. Descarcări-0. Vizualizări-642
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The effect of dissolved oxygen on the rate of pulsed electrodeposition of copper and bismuth nanowires under the conditions of template synthesis
Globa Pavel, Sidelinicova Svetlana, Ţînţaru Natalia, Dicusar Alexandr
Institute of Applied Physics, Academy of Sciences of Moldova
Russian Journal of Electrochemistry
Nr. / 2011 / ISSN 1023-1935 /ISSNe 1608-3342
Disponibil online 16 January, 2024. Descarcări-0. Vizualizări-34
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Shape evolution during through-mask electrochemical micromachining at low and high aspect ratio
Dicusar Alexandr, Keloglu O., Iuşcenco Serghei
Academy of Sciences of Moldova
Proceedings of the International Semiconductor Conference
Vol. 2. 1998. New Jersey. DOI 10.1109/SMICND.1998.732248.
Disponibil online 1 December, 2023. Descarcări-0. Vizualizări-73
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