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SM ISO690:2012 BĂJENESCU, Titu-Marius. MEMS-based devices relevant failure modes and mechanisms. In: EEA - Electrotehnica, Electronica, Automatica, 2013, vol. 61, pp. 16-20. ISSN -. |
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EEA - Electrotehnica, Electronica, Automatica | ||||||
Volumul 61 / 2013 / ISSN - /ISSNe 1582-5175 | ||||||
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Pag. 16-20 | ||||||
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MEMS are one of the most promising areas in future computer and machinery, the next logical step in the silicon revolution. Substantial process improvements were made with additional inspection to identify weak structures. MEMS structures exhibit a variety of failure mechanisms, but many can be eliminated through design and existing packaging methods. Packaging is crucial to ensuring long-term reliability. For high reliability applications the packaging costs can often exceed the cost of the device. |
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Cuvinte-cheie Failure modes and mechanisms, MEMS/MEOMS, Packaging, Process improvements, reliability, Risk, Yield |
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