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 SM ISO690:2012LANIN, V.. Activation of Soldered Connections in the Process of Formation Using the Energy of Ultrasonic and Electric Fields
. In: Surface Engineering and Applied Electrochemistry, 2008, nr. 3(44), pp. 234-239. ISSN 1068-3755. |
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  Surface Engineering and Applied Electrochemistry |
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| Numărul 3(44) / 2008 / ISSN 1068-3755 /ISSNe 1934-8002 | ||||||
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| Pag. 234-239 | ||||||
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Modeling and experimental research of diffusion processes during formation of soldered connections under the influence of energy of ultrasonic and electric fields were performed. It was found that the concentration of diffusion elements increased in the interface depth by 30–45%; owing to this, the durability of the connections with difficult-to-solder metals increased by a factor of 1.25–1.5.
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