Failure Analysis and Reliability Aspects of Electronic Components
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BĂJENESCU, Titu-Marius. Failure Analysis and Reliability Aspects of Electronic Components. In: EEA - Electrotehnica, Electronica, Automatica, 2024, vol. 72, pp. 47-57. ISSN -. DOI: https://doi.org/10.46904/eea.24.72.1.1108006
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EEA - Electrotehnica, Electronica, Automatica
Volumul 72 / 2024 / ISSN - /ISSNe 1582-5175

Failure Analysis and Reliability Aspects of Electronic Components

DOI:https://doi.org/10.46904/eea.24.72.1.1108006

Pag. 47-57

Băjenescu Titu-Marius12
 
1 Military Technical Academy Bucharest,
2 Technical University of Moldova
 
 
Disponibil în IBN: 26 aprilie 2024


Rezumat

Failure analysis (FA) is the process of determining the cause of failure, collecting, and analysing data, and developing conclusions to eliminate the failure mechanism (FM) causing specific device or system failures. Why it is so important to use FA, i.e. to know the cause of product failure, this is what we intend to describe in this article. Reliability analysis is not at all the only ‘customer’ of FA. Other fields, such as business management and military strategy are using this term. In order to offer to the reader a more complete picture, we identified the possible applications of FA in various fields (industry, research, etc.), which are detailed in the article. 

Cuvinte-cheie
business management, Device failures, Electronic component, Failure mechanism, Industry research, Physics of failures, Product failures, System failures