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 SM ISO690:2012DIKUSAR, Aleksandr , KELOGLU, O., YUSHCHENKO, Serghei. Shape evolution during through-mask electrochemical micromachining at low and high aspect ratio. In: Proceedings of the International Semiconductor Conference: CAS, Ed. 21, 6-10 octombrie 1998, Sinaia. New Jersey: Institute of Electrical and Electronics Engineers Inc., 1998, Vol. 2, pp. 557-560. DOI: https://doi.org/10.1109/SMICND.1998.733811 |
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| Proceedings of the International Semiconductor Conference Vol. 2, 1998 |
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Conferința "International Semiconductor Conference" 21, Sinaia, Romania, 6-10 octombrie 1998 | ||||||
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| DOI:https://doi.org/10.1109/SMICND.1998.733811 | ||||||
| Pag. 557-560 | ||||||
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Shape evolution during through-mask electrochemical micromachining was investigated to study the problem of dissolution (electrodeposition) uniformity at low and high aspect ratio. Mathematical model to predict shape evolution by assuming primary current distribution is advanced. The results of calculation are compared with the experimental data on anodic dissolution of copper in neutral nitrate solutions. |
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| Cuvinte-cheie Aspect ratio, copper, Electric current distribution, Electrochemical cutting, mathematical models, Nitrates |
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