Afișare rezultate |
Afisarea articolelor 1-1(1) pentru cuvîntul-cheie "Thin Film Fracture Approach"
Integration of metal and metal oxide nanowires directly on chip by top-down technology and their electrical characteristics |
Gedamu Dawit M.1, Lupan Oleg12, Mishra Yogendra Kumar1, Adelung Rainer1 |
1 Christian-Albrechts University of Kiel, 2 Technical University of Moldova |
Journal of Nanoelectronics and Optoelectronics |
Nr. / 2014 / ISSN 1555-130X |
Disponibil online 28 August, 2023. Descarcări-0. Vizualizări-118 |
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