The results of the investigations of heat transfer and development of the boiling process carried out on the basis of high-speed filming under the conditions of the effect of an electric field are presented in this work. An airtight chamber with the heat transfer surface in the form of a stainless tube of diameter 4 mm was used in the experiments. A high voltage electrode – some perforated flat surface – was arranged over the heat transfer surface. Hexane was used as a heat carrier. The experimental results on the crisis of boiling and heat transfer show that the enhancement of it decreases with the growth of the heat flux and is almost absent at the developed boiling mode. Within the convective region and at the steady film boiling it is observed a high rate of heat transfer and the increase of critical heat loads. From the standpoint of the process particularities it is considered the vapor formation conditions depending on the value of the heat flux. Characteristic dependences of heat transfer on the heat flux density at boiling in a large volume testify that the field strength growing the heat transfer rate increases. Without any field, when the vapor bubble, growing in the active center, interacts with the previous one, there takes place the anticipatory separation of a little bubble and the junction of it with previously separated ones; a group of little bubbles forms, ensuring a violent turbulization of the near-wall liquid layer; the process proceeds until large bubbles go far from the heat transfer surface. Then the cycle of the vapor bubble separation is repeated. At the lower part of the heat transfer surface there also takes place the formation of vapor bubbles which move upward along the forming heat surface. The formed vapor bubble join with new bubbles growing on the side heat surface. As a result there forms a large vapor bubble with dimensions up to 1500 mkm. The effect of the field at the initial stage at the strength of about 10 kV/cm causes the suppression of boiling only on the upper part of the surface, in this case the centers, which previously form large vapor bubbles, continue to work, but generating smaller ones. On the side and lower heat transfer surfaces larger bubbles are generated which under the action of the field are thrown out along the generatrix. Under the heat surface the velocity of the vapor bubbles reduces and they remain immovable for some time. Then the following growing bubbles join them. The initial vapor bubble grows and emerges far from the heat surface. The effect of the electric field within the interelectrode gap results in the “ram effect” of the formation of microcirculation flows near the heat surface, directed downward, and the vapor bubble becomes smaller until it is suppressed. The liquid forms a thin layer at the surface and the appearing flows together with the evaporation in little bubbles causes the drop of the wall temperature eliminating its nonuniform distribution along the surface typical for the case of boiling without field. The vapor bubbles without field with the growth rate of 70 mm/s attains the diameters of 700 mkm. And it is possible the generation of vapor bubbles with diameter of 200 mkm in some centers. At small strengths (about 4–5 kV/cm) the convective waves are directed upward and, as the field strength grows, the disturbances extend downward, and the liquid on the heat surface, facing the high voltage electrode, remains undisturbed. Consequently, the electric effect considerably predominates over thermal convection pressing up the hot layers of the liquid.