Particularities of the Electroplating Process in the Case of a Single-Phase Power Supply with an Embedded Induction-Capacitance Device
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GOLOGAN, Viorel, BOBANOVA, Zh., IVASHKU, S., POPOV, V., MAZUR, Victor. Particularities of the Electroplating Process in the Case of a Single-Phase Power Supply with an Embedded Induction-Capacitance Device . In: Surface Engineering and Applied Electrochemistry, 2007, nr. 2(43), pp. 83-86. ISSN 1068-3755.
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Surface Engineering and Applied Electrochemistry
Numărul 2(43) / 2007 / ISSN 1068-3755 /ISSNe 1934-8002

Particularities of the Electroplating Process in the Case of a Single-Phase Power Supply with an Embedded Induction-Capacitance Device

Pag. 83-86

Gologan Viorel, Bobanova Zh., Ivashku S., Popov V., Mazur Victor
 
Institute of Applied Physics, Academy of Sciences of Moldova
 
 
Disponibil în IBN: 29 noiembrie 2013


Rezumat

This paper presents experimental data on the use of a single-phase power supply and inductioncapacitance device for copper electroplating. It is shown that the electrode potential and deposit structure depend on the values of the induction and capacitance through the influence of alternating components.