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 SM ISO690:2012COJOCARU, Ala, CARSTENSEN, Juergen, BOOR, J., SCHMIDT, V., FOLL, Helmut. Investigation of mesoporous structures for thermoelectric applications. In: Nanotechnologies and Biomedical Engineering, Ed. 1, 7-8 iulie 2011, Chișinău. Technical University of Moldova, 2011, Editia 1, pp. 21-23. ISBN 978-9975-66-239-0.. |
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| Nanotechnologies and Biomedical Engineering Editia 1, 2011 |
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Conferința "International Conference on Nanotechnologies and Biomedical Engineering" 1, Chișinău, Moldova, 7-8 iulie 2011 | |
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| Pag. 21-23 | |
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Mesoporous silicon is an attractive material for thermoelectric application. For pore wall thicknesses around <100nm, phonons can not penetrate the porous layer while electrons still can, due to there smaller mean free path length. The resulting good electrical and bad thermal conductivity is a premise for efficient thermoelectric devices. This paper presents results regarding homogeneity, high porosity, and optimal pore wall thicknesses for porous silicon based thermoelectric devices. |
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| Cuvinte-cheie Electrochemical etching, mesoporous silicon, thermoelectric |
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