Особенности механизма прохождения тока через изотипную структуру ITO/nSi
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СИМАШКЕВИЧ, Алексей, ШЕРБАН, Д., БРУК, Л., ФЁДОРОВ, Владимир, КОВАЛЬ, Андрей, USATÎI, Iurie. Особенности механизма прохождения тока через изотипную структуру ITO/nSi . In: Электронная обработка материалов, 2010, nr. 1(46), pp. 44-47. ISSN 0013-5739.
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Электронная обработка материалов
Numărul 1(46) / 2010 / ISSN 0013-5739 /ISSNe 2345-1718

Особенности механизма прохождения тока через изотипную структуру ITO/nSi

Pag. 44-47

Симашкевич Алексей1, Шербан Д.1, Брук Л.1, Фёдоров Владимир2, Коваль Андрей2, Usatîi Iurie1
 
1 Институт прикладной физики АНМ,
2 Молдавский Государственный Университет
 
 
Disponibil în IBN: 31 martie 2017


Rezumat

Solar cells fabricated on the basis of semiconductor-insulator-semiconductor (SIS) structures were obtained by deposition of transparent conductive ITO films onto silicon crystal substrates by spray pyrolisys technique. The obtained in such a way structures may be considered as Schottky diodes with a thin insulating SiO2 layer at the interface formed during the ITO layer deposition. The investigation of I-V characteristics shows that in n ITO/SiO2/nSi structures two mechanisms of the direct current flow are presented: (i) tunnelingrecombination at direct voltages of less than 0.3 V and (ii) over-barrier emission at voltages higher than 0.3 V. In the first case the direct current flow could be interpreted as multi-steps tunnel-recombination transitions of electrons from the silicon conduction band into ITO conduction band, the number of steps being about 100. In the second case the calculated from I-V characteristics height of the potential barrier at the ITO-Si interface is about 0.65-0.68eV.