Quality and Reliability Evolution of Electronic Components
Închide
Conţinutul numărului revistei
Articolul precedent
Articolul urmator
244 1
Ultima descărcare din IBN:
2022-09-23 02:51
SM ISO690:2012
BĂJENESCU, Titu-Marius. Quality and Reliability Evolution of Electronic Components. In: EEA - Electrotehnica, Electronica, Automatica, 2022, nr. 2(70), pp. 1-8. ISSN -. DOI: https://doi.org/10.46904/eea.22.70.2.1108001
EXPORT metadate:
Google Scholar
Crossref
CERIF

DataCite
Dublin Core
EEA - Electrotehnica, Electronica, Automatica
Numărul 2(70) / 2022 / ISSN - /ISSNe 1582-5175

Quality and Reliability Evolution of Electronic Components

DOI:https://doi.org/10.46904/eea.22.70.2.1108001

Pag. 1-8

Băjenescu Titu-Marius12
 
1 Military Technical Academy Bucharest,
2 Technical University of Moldova
 
 
Disponibil în IBN: 13 iulie 2022


Rezumat

Today, most of the companies understand that the reliability must be built in at the design phase and then, monitored during the whole manufacturing process. Reliability building means the totality of techniques and procedures having the goal to ensure a foreseen reliability level for a given product. This concept is linked with reliability assessing, which cover the whole evaluation system aiming to find out and record, during and after the manufacturing process, the reliability level of the batch of products. This evaluation system contains tests, electrical measurements, failure analysis and statistical processing of data.

Cuvinte-cheie
effects of environment, environmental stress screening ESS, nanopackaging, Process reliability, reliability centred maintenance RCM, stressor, susceptibility analysis