Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation
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2022-01-13 03:37
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GRABCO, Daria, PYRTSAC, Constantin, ŞIKIMAKA, Olga. Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation. In: Nanotechnologies and Biomedical Engineering, Ed. 5, 3-5 noiembrie 2021, Chişinău. Chişinău: Pontos, 2021, Ediția 5, p. 64. ISBN 978-9975-72-592-7.
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Nanotechnologies and Biomedical Engineering
Ediția 5, 2021
Conferința "Nanotechnologies and Biomedical Engineering"
5, Chişinău, Moldova, 3-5 noiembrie 2021

Relaxation Parameters of Cu/substrate Type Coated Systems under Nanoindentation


Pag. 64-64

Grabco Daria1, Pyrtsac Constantin12, Şikimaka Olga1
 
1 Institute of Applied Physics,
2 Technical University of Moldova
 
 
Disponibil în IBN: 16 noiembrie 2021


Rezumat

In this work, we studied the relaxation parameters, he-p and hres, of three composite structures Cu/LiF, Cu/MgO, and Cu/Si, which have different types of a chemical bond between the substrates (ionic (LiF), ionic-covalent (MgO), and covalent (Si)) and differ in hardness (HCu = 0.6 GPa, HLiF, HMgO and HSi are 1.2, 7.5 and 8.2 GPa, respectively). For each type of substrates, coated systems (CSs) were fabricated with a following Cu film thickness: t1 = 85; t2 = 470 and t3 = 1000 nm. The behavior of relaxation parameters was examined over a wide range of loads, P=2-900 mN, during nanoindentation. The elasticplastic parameters were shown to depend on the CS type, as well as on the film thickness and the magnitude of the applied load.