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SM ISO690:2012 PLETEA, Ionica-Marcela, ŞONTEA, Victor, COJOCARU, Victor. Impactul conexiunilor verticale asupra ariei in integrarea 3D. In: Telecommunications, Electronics and Informatics, Ed. 6, 24-27 mai 2018, Chișinău. Chișinău, Republica Moldova: 2018, Ed. 6, pp. 375-377. ISBN 978-9975-45-540-4. |
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Telecommunications, Electronics and Informatics Ed. 6, 2018 |
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Conferința "Telecommunications, Electronics and Informatics" 6, Chișinău, Moldova, 24-27 mai 2018 | ||||||
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Pag. 375-377 | ||||||
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3D monolithic integration allows more then an alternative for increasing density integration. This offers a new dimension of flexibility in designing integrated circuits, more exactly the ability to devide the project into partitions that can be independetly processed and operated. In the current 2D integration technology, the logical part, memories and the analog functions are processed together and have the same limitations and cost. In a 3D integration each layer can be processed in a optimized flow. In this paper we have integrated a 3D design which contains logical part and memories. We overlap memories on logical part and we present the avantages of 3D integration versus 2D in terms of area. |
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Cuvinte-cheie partitioning, D integration, area optimization, flow 2D, 3 |
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