Infrared Heating in the Technology of Soldering Components in Electronics
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2022-12-22 10:38
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LANIN, V.. Infrared Heating in the Technology of Soldering Components in Electronics . In: Surface Engineering and Applied Electrochemistry, 2007, nr. 5(43), pp. 381-386. ISSN 1068-3755.
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Surface Engineering and Applied Electrochemistry
Numărul 5(43) / 2007 / ISSN 1068-3755 /ISSNe 1934-8002

Infrared Heating in the Technology of Soldering Components in Electronics

Pag. 381-386

Lanin V.
 
 
 
Disponibil în IBN: 13 decembrie 2013


Rezumat

Parameters of infrared heating for soldering electronic components using surface mounting are investigated and optimized. The main advantages of IR heating are as follows: high rate, low lag effect, possibility to effectively change the temperature and time profile of heating, and the relative simplicity of the equipment.