Miniaturisation of electronic components and the problem of devices overheating
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BĂJENESCU, Titu-Marius. Miniaturisation of electronic components and the problem of devices overheating. In: EEA - Electrotehnica, Electronica, Automatica. 2021, nr. 2(69), pp. 53-58. ISSN -.
10.46904/EEA.21.69.2.1108006
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EEA - Electrotehnica, Electronica, Automatica
Numărul 2(69) / 2021 / ISSN - /ISSNe 1582-5175

Miniaturisation of electronic components and the problem of devices overheating

DOI: https://doi.org/10.46904/EEA.21.69.2.1108006

Pag. 53-58

Băjenescu Titu-Marius12
 
1 Technical University of Moldova,
2 Military Technical Academy Bucharest
 
Disponibil în IBN: 29 iunie 2021


Rezumat

With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact, and new technologies are needed to extract the heat in a more sustainable way-that is, requiring less water and energy. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management. However, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. By removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip. 

Cuvinte-cheie
Cooling of ICs, electronics, Microfluidics, Photonics, Thermal management, Thermal packaging