Conţinutul numărului revistei |
Articolul precedent |
Articolul urmator |
380 2 |
Ultima descărcare din IBN: 2023-08-10 22:39 |
Căutarea după subiecte similare conform CZU |
004.7 (525) |
Computer communication. Computer networks (514) |
SM ISO690:2012 BĂJENESCU, Titu-Marius. Some reliability aspects of MEMS and NEMS manufacturing. In: Journal of Engineering Sciences, 2021, vol. 28, nr. 2, pp. 91-102. ISSN 2587-3474. DOI: https://doi.org/10.52326/jes.utm.2021.28(2).07 |
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Journal of Engineering Sciences | ||||||
Volumul 28, Numărul 2 / 2021 / ISSN 2587-3474 /ISSNe 2587-3482 | ||||||
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DOI:https://doi.org/10.52326/jes.utm.2021.28(2).07 | ||||||
CZU: 004.7 | ||||||
Pag. 91-102 | ||||||
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A full understanding of the physics and statistics of the defect generation is required to investigate the ultimate reliability limitations of manufacturability of MEMS and NEMS. In order that the user can include electronic components in circuits to achieve error-free and reliable functional units, assemblies or devices, must he has understood the mode of operation of these components. Only knowledge of their parameters and special properties allows, according to data sheet specifications and manufacturer's documents the optimal components for a specific application, to select. Both for the analysis of electronic circuits and for circuit dimensioning are knowledge of the structure and function of the used components of semiconductor electronics absolutely necessary. |
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Cuvinte-cheie Failure mode, Failure mechanism, failure analysis, wafer-level reliability semiconductor, crystallographic defects, mod de eșec, mecanism de eșec, analiză de eșec, fiabilitate la nivel de conjunctură semiconductoare, defecte cristalografice |
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