Afiliat la Institutul National de Cercetare si Dezvoltare pentru Microtehnologii IMT-Bucuresti
Materials for integrated of THz sensors in EWOD chips |
, , Dănilă Mihai , , , Comanescu Florin Constantin , , Baracu Angela Mihaela , Dascălu Traian |
Microelectronics and Computer ScienceThe 5th International Conference |
Ediția 8. 2014. Chișinău, Republica Moldova. Universitatea Tehnică a Moldovei. 102-105. |
Disponibil online 11 April, 2019 |
Porous and RF sputtering InP for portable THz-TDS in pharmaceutical and medical applications |
, Ghimpu Lidia , Dănilă Mihai , , , Comanescu Florin Constantin , Ionescu Alina , Grigore Oana , Dascălu Traian , |
Proceedings of the International Semiconductor Conference CAS |
Ediția 36. 2013. New Jersey. Institute of Electrical and Electronics Engineers Inc.. 69-72. |
Disponibil online 13 December, 2023 |
Hydrophobic ZnO used in EWOD technology and SAW devices for better bio-fluid slip at microchannel walls controlled by DC pulses |
, Ghimpu Lidia , , , , , Dascălu Traian |
Proceedings of the International Semiconductor Conference CAS |
Vol. 1. 2012. New Jersey. Institute of Electrical and Electronics Engineers Inc.. 231-234. |
Disponibil online 13 December, 2023 |
Nanoperforated indium phosphide for Terahertz imaging bio-applications |
Esinenco Dorin , , , Ghimpu Lidia , , , Dănilă Mihai , , Dascălu Traian , , |
Nanotechnologies and Biomedical Engineering |
Editia 1. 2011. . Technical University of Moldova. 207-210. |
Disponibil online 3 July, 2019 |
Nanostructured indium phosphide used in electrowetting system for biosensor applications |
, , Esinenco Dorin , , , Dănilă Mihai , Ghimpu Lidia , , |
Proceedings of the International Semiconductor Conference CAS |
Vol. 2. 2011. New Jersey. Institute of Electrical and Electronics Engineers Inc.. 237-240. |
Disponibil online 12 December, 2023 |
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