Titanium carbide (TiC) coatings possess many useful properties: extreme hardness, high strength, resistance to heat, corrosion and wear, high resistance to chemical attack, high thermal stability, and good electrical and thermal conductivity. The deposition of TiC films by vapor deposition techniques is now common practice. The layers can be produced by different processes, divided basically into two main groups: chemical vapor deposition (CVD) and physical vapor deposition (PVD). In this study, we present the effect of the plasma deposition parameters on the properties of TiC layers. The elaboration of our films has been carried out by RF-Magnetron Sputtering (13.56 MHz) under argon atmosphere at low pressure and the target of titanium carbide. The film depositions have been done on silicon and steel substrates. The total pressure was 10mTorr. The attention was given to study the influence of different parameters (deposition time, RF power and substrate-bias) on the properties of TiC layers. The deposited layers were characterized by X-ray diffraction (XRD), energy dispersive spectroscopy (EDS), atomic force microscopy (AFM), Raman scattering and micro-indentation.